| abstract |
A photosensitive resin composition capable of forming a pattern at a low temperature is provided. A photosensitive resin composition comprising a binder resin (A), a polymerizable compound (B) represented by the following formula (I), and a polymerization initiator (C) represented by the following formula (II). (R1 represents a hydrogen atom or a methyl group) (In the formula, each * represents a bond.) [Selection figure] None |