http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014045018-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2012-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b1df7af08b342088c66a7c81719b8e6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dce7491a921ff209ab63aa129183668e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5e045498660af09c88988db26f09aa5 |
| publicationDate | 2014-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2014045018-A |
| titleOfInvention | Printed wiring board |
| abstract | To provide a printed wiring board that is thin and has low warpage and high reliability in via connection. A resin insulating layer is formed of an asymmetric resin film including a reinforcing layer, and the reinforcing layer is close to an upper surface of the resin insulating layer and is in contact with a conductor layer. The via conductor penetrates the resin and the reinforcing layer of the resin insulating layer and reaches the conductor layer. [Selection] Figure 1 |
| priorityDate | 2012-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.