| abstract |
Provided is a terminal structure having excellent bump portion strength. A suitable terminal structure includes a base material, an electrode formed on the base material, an insulating coating layer formed on the base material and the electrode, and having an opening exposing at least a part of the electrode. An under bump metal layer containing Ni and formed in a region in the opening on the electrode so that the upper surface is lower than the peripheral edge of the opening in the insulating coating layer; and in the opening on the under bump metal layer And a dome-shaped bump containing Sn and Ti formed in the region, and an end of the boundary between the under bump metal layer and the bump is in contact with an inner wall of the opening in the insulating coating layer. [Selection] Figure 2 |