http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014041969-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
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filingDate 2012-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99dbad7612276028ddce8d5f3d77469d
publicationDate 2014-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2014041969-A
titleOfInvention Method for manufacturing printed wiring board
abstract [PROBLEMS] To provide a printed wiring board in which manufacturing conditions are easily controlled without performing electroless plating, an expensive facility is not required, and conductive layers exposed on the outermost layer of the substrate are reliably electrically connected. It is an object to provide a manufacturing method. A substrate preparing step of preparing a substrate in which insulating layers and conductive layers are alternately stacked and the conductive layer is exposed in an outermost layer; a through hole forming step of forming a through hole penetrating the substrate; A conductive ink application step of applying a conductive ink containing metal particles to the surface of the inner hole of the through hole and the surface of the conductive layer exposed on the outermost layer, and a heat treatment is performed after the conductive ink application step. A method for manufacturing a printed wiring board comprising at least a heat treatment step is provided. [Selection] Figure 3
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Total number of triples: 33.