| abstract |
A laminate having a low degree of thermal expansion, a high glass transition temperature, excellent flame retardancy, a high degree of cure, that is, a low ΔTg, which is required as a printed wiring board material even when cured at low temperatures It is an object to provide a resin composition obtained from the above, a prepreg, a laminate, a metal foil-clad laminate and a printed wiring board using the resin composition. A resin composition comprising an imidazole compound (A) represented by formula (1), an epoxy compound (B), a phenol compound (C) and a maleimide compound (D). [Selection figure] None |