| abstract |
[PROBLEMS] To have low thermal expansion, high glass transition temperature, good dielectric properties, excellent balance in all of copper foil adhesion, solder heat resistance, heat resistance with copper, and flame retardancy, and safety with low toxicity. Provided is a thermosetting resin composition that is excellent in properties and working environment and suitable for electronic parts and the like. A compound (A) having at least one maleimide group and at least one primary amino group in the molecular structure represented by the following general formula (I), and two aldehyde groups in the molecular structure: A thermosetting resin composition comprising a compound (B) having an aromatic condensed phosphate ester (C) having a structure, and a prepreg and a laminate using the thermosetting resin composition. [Selection figure] None |