| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 |
| filingDate |
2012-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_203b8b158e3973297cea1f8f49297c43 |
| publicationDate |
2014-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2014032979-A |
| titleOfInvention |
Resin substrate, prepreg, printed wiring board, semiconductor device |
| abstract |
To provide a resin substrate having excellent lead-free solder reflow properties and reduced warpage during mounting. A resin substrate 100 of the present invention includes a fiber base 101 and an insulating resin layer 103, and is obtained by impregnating the fiber base 101 with a resin material. And the 1% weight reduction temperature of the resin substrate 100 is 350 degreeC or more and 500 degrees C or less. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7192681-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016196556-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022107563-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021008584-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020130007-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015224342-A |
| priorityDate |
2012-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |