http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014031460-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_063a1b324005ddc15e16e7529c6258c4 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2012-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55f1a9bfa671bc63d4862d7391758bc5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0af07304a9b78eb623d4d2c80a6eac5d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eafd63faad8f8ffc98eab62e88a910b1 |
| publicationDate | 2014-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2014031460-A |
| titleOfInvention | Epoxy resin composition for sealing and semiconductor device using the same |
| abstract | PROBLEM TO BE SOLVED: To provide a sealing material used in a packaging method for simultaneously sealing a gap between a semiconductor element and a substrate and the semiconductor element itself by transfer molding, and suppresses generation of burrs during molding, and has high thermal conductivity characteristics. And an epoxy resin composition for sealing excellent in filling of voids and a semiconductor device using the same. A sealing epoxy resin composition for transfer molding of a semiconductor device using flip-chip mounting, comprising: (A) an epoxy resin, (B) a curing agent, (C) a curing aid, (D) An inorganic filler is an essential component, the (D) inorganic filler is included in the range of 75 to 95% by mass of the entire resin composition, and the structure of (D) includes 60 vol% or more of alumina, It is characterized by having a particle size distribution containing 99.9 Vol% or more of particles having a particle size of 32 μm or less, 5 Vol% or more of particles having a particle size of 0.5 μm or less, and having an average particle size in the range of 1 to 10 μm. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113105720-A |
| priorityDate | 2012-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.