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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-02
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filingDate 2013-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_52cca6a9292469f4ccf25facefa11b26
publicationDate 2014-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2014029855-A
titleOfInvention Conductive particles and solder joint materials
abstract After joining first and second members to be welded, the joining reliability and heat dissipation of the first and second members to be joined are improved, and the distance between the first and second members to be joined is further increased. It is possible to provide conductive particles capable of obtaining a solder paste or a solder sheet capable of controlling the temperature with high accuracy. The conductive particles according to the present invention are conductive particles dispersed in solder and used as a solder paste or a solder sheet. The conductive particle 21 includes a base particle 22 and a conductive layer 23 disposed on the surface 22 a of the base particle 22. The substrate particles 22 are resin particles or organic / inorganic hybrid particles. The specific gravity of the conductive particles 21 is 1.5 or more and 4.0 or less. The particle diameter of the conductive particles 21 is 8 μm or more and 200 μm or less. [Selection] Figure 1
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