| abstract |
The present invention provides a resin composition that is excellent in fluidity, heat resistance, and flame retardancy and can be suitably used for sealing materials. A resin composition for an encapsulant containing an epoxy resin, the resin composition for an encapsulant comprising (A) an epoxy resin, (B) an acid anhydride, an amine compound, and a phenol compound. At least one selected from the group, (C) an organic group-containing silsesquioxane, (D) silica, and (E) a composite metal oxide, and the epoxy resin, acid anhydride, amine compound, and At least 1 sort (s) chosen from the group which consists of a phenolic compound is 100 degreeC or more in melting | fusing point, The resin composition for sealing materials characterized by the above-mentioned. [Selection figure] None |