| abstract |
In a wet roughening process, not only the arithmetic average roughness of the insulating layer surface is low but also the root mean square roughness is low, and a plated conductor layer having sufficient peel strength can be formed thereon, and linear heat The expansion coefficient is also low. A resin composition containing an epoxy resin, a curing agent, and an inorganic filler, wherein the inorganic filler is surface-treated with an aminoalkylsilane, and a non-volatile component in the resin composition is 100% by mass. In that case, the content of the inorganic filler is 55 to 90% by mass. [Selection figure] None |