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filingDate 2012-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2014-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2014027151-A
titleOfInvention Wiring board and electronic device
abstract PROBLEM TO BE SOLVED: To provide a wiring board capable of strengthening the bonding between the wiring board and a resin. A wiring board includes an insulating substrate and a metal member having a side surface including a concave portion provided on the upper surface of the insulating substrate. It is provided away from the upper end. When the electronic component 2 is mounted on the wiring board 1 and the electronic component 2 and the metal member 12 are covered with the resin and the electronic component 2 is sealed, the resin 4 enters the recess 13 on the side surface of the metal member 12 and the resin 4 Is caught by the metal member 12, it is possible to reduce the peeling of the resin 4 from the wiring board 1. [Selection] Figure 2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018014454-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019107430-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017135406-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017033890-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020009913-A
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