http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014027013-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2012-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f97399228b70a114e318556d343bea01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41e610213706e1b2e27c9844b717fd3b |
| publicationDate | 2014-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2014027013-A |
| titleOfInvention | Printed wiring board |
| abstract | Provided is a printed wiring board which is less likely to warp even when a heat cycle is applied and has a high component mounting yield. The printed wiring board does not have a solder resist layer corresponding to the solder resist layer existing on the opposite surface on the outermost resin insulating layer of the buildup layer including the outermost resin insulating layer, and the dam 520 And a stiffener 57. Therefore, the volume difference between the conductors of each layer is small. Further, since the underfill does not flow outside the dam 520 and affects the pad 59PF, the connection reliability between the passive component and the pad 59PF is increased. [Selection] Figure 6 |
| priorityDate | 2012-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 19.