http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014022439-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2012-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a078b62f2d0d9588e12a5d5947ae74d9 |
| publicationDate | 2014-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2014022439-A |
| titleOfInvention | Printed wiring board and manufacturing method thereof |
| abstract | [PROBLEMS] To improve the mounting yield of a semiconductor element. The melting point of a first bump 76FI on the center side in a semiconductor element mounting area is lower than the melting point of a second bump 76FO located on the outer periphery. For this reason, at the time of reflow, first, the low-melting first bump 76FI on the center side melts to contact the pad 92 corresponding to the CC side of the semiconductor element, and further the semiconductor element 92 sinks. Then, the second high-melting-point second bump 76FO starts to melt, and the second bump and the pad 92 corresponding to the CC outer side come into contact with each other. [Selection] Figure 5 |
| priorityDate | 2012-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.