abstract |
Disclosed is a resin composition that can prevent resin chipping even though the linear thermal expansion coefficient of a cured product of the resin composition is low. A resin composition containing an inorganic filler, an epoxy resin, and a curing agent, wherein the inorganic filler is 60% by mass or more when the nonvolatile component in the resin composition is 100% by mass, The resin composition whose folding-resistant frequency | count of the hardening body of the said resin composition is 10 times or more. [Selection figure] None |