http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014012778-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_de498babb0c04a00ceb653738877b147 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 |
filingDate | 2012-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50f28ae78ece3fd779cb7e0ddf5d9a7e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_128047369c26cf1189ebbd231bf8acc9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c97f487624edd0f797a809bae40b00f9 |
publicationDate | 2014-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2014012778-A |
titleOfInvention | Resin composition and adhesive comprising the same |
abstract | Disclosed is a resin composition that is particularly excellent in adhesion to metals and is tough, and that is suitable as an adhesive for electrical and electronic materials. (A) A sulfur-containing epoxy compound represented by the following formula (I), (B) an epoxy compound not containing a sulfur atom, and (C) an epoxy resin curing agent. ) Component and (B) component use ratio (A) / (B) in a mass ratio of 5/95 to 90/10; wherein n in formula (I) is Represents an integer of 0 to 3, and X 1 and X 2 each independently represent a hydrogen atom or a methyl group. [Selection figure] None |
priorityDate | 2012-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 135.