| abstract |
It is possible to easily inspect whether a semiconductor device is faulty or a semiconductor device that is likely to fail. A semiconductor device includes a substrate 2, a semiconductor chip 3 mounted on the substrate, a sealing resin portion 4 for sealing the semiconductor chip, and a material that emits an odor provided in the sealing resin portion. It is assumed that the capsule 5 includes 5A and an outer shell 5B that encloses a material that emits an odor and breaks when the temperature exceeds the operation guarantee temperature of the semiconductor chip. [Selection] Figure 1 |