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publicationDate 2014-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2014007204-A
titleOfInvention LED module
abstract Provided is an LED module capable of improving heat dissipation and capable of increasing light output. In an LED module, a mounting substrate is disposed on a heat transfer section on which one side of the LED chip is mounted, and on the other side of the heat transfer section. And a wiring pattern 22 to be connected. The LED module 1 includes a first sealing portion 37 embedded in the through hole 20 b of the heat transfer portion 20 and sealing a portion of the wire 26 in the through hole 20 b, and the LED chip 3 and the LED 26 of each wire 26. A second sealing portion 36 that seals a portion between the chip 3 and the first sealing portion 37 is provided. The second sealing portion 36 includes a fluorescent material that is excited by light emitted from the LED chip 3 and emits light having a longer wavelength than the LED chip 3 and a transparent material. The 1st sealing part 37 contains the 1st filler with a high reflectance in the 1st resin compared with the 1st resin concerned. [Selection] Figure 1
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Total number of triples: 31.