http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013534366-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1815 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30107 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-0024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-003 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00 |
| filingDate | 2011-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013534366-A |
| titleOfInvention | Method for manufacturing electronic device assembly having electromagnetic shield and heat radiation portion, and electronic device having electromagnetic shield and heat radiation portion |
| abstract | The electronic device includes a substrate (120), at least one electronic component (171 to 173) provided on the substrate (120), and an encapsulating part (140) covering at least one electronic component (171 to 173). Prepare. The electromagnetic protective layer (130) covers the surface (143) of the enclosing portion (140) facing the substrate (120) and the side surfaces (121, 141, 122, 142) orthogonal to the surface (143). To do. In the present invention, the electromagnetic protective layer (130) is surrounded by the encapsulated portion of the electronic device (111, 112) by the thermal and / or electrical connection (134, 162 to 166) with respect to the region (168). Connected thermally and / or electrically. In manufacturing the electronic device, the electronic device is separated from the panel, and then the electromagnetic protective layer (130) is formed. [Selection] Figure 8A |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10600560-B2 |
| priorityDate | 2010-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.