http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013517375-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12715 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-48 |
| filingDate | 2010-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013517375-A |
| titleOfInvention | Immersion tin-silver plating in electronic article manufacturing |
| abstract | A method for depositing a whisker-resistant tin-based coating layer on a surface of a copper substrate is provided. The method is useful for applying a tin-based coating layer on a surface of a copper substrate having a surface, and the tin-based coating layer has a thickness of 0.5 to 1.5 μm. And suppressing the formation of copper-tin intermetallic compounds, wherein the suppression of intermetallic compound formation is such that when the article is exposed to at least seven heating / cooling cycles, each cycle causes the article to be at least 217. Heating to <RTIgt; C, </ RTI> followed by cooling to 20-28 <0> C, resulting in a region of at least 0.25 [mu] m thick copper-free tin coating layer remaining. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015081372-A |
| priorityDate | 2009-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 87.