| abstract |
【Task】 A method and system for cleaning corrosion products of a metal capping layer from a surface of a substrate is provided. According to one embodiment, the treatment solution includes a surfactant, a complexing agent, and a pH adjusting agent. The surfactant is configured to improve wetting of the wafer surface and inhibit further corrosion of the capping layer. The complexing agent is configured to bind to metal ions desorbed from the substrate surface. The pH adjuster is configured to adjust the pH to a desired level to promote desorption of corrosion products from the substrate surface. [Selection] Figure 4 |