| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45169
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81444
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85444
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49894 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2010-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2013-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2013502734-A |
| titleOfInvention |
Carrier device, arrangement comprising such a carrier device, and method for patterning a laminate comprising at least one ceramic layer |
| abstract |
A method for patterning a stack comprising at least one ceramic layer includes providing a ceramic layer (101) comprising at least one through hole (102). A conductive layer (103) is applied over the ceramic layer (101), and the conductive layer (103) is electrically coupled to at least one through hole (102). An additional layer (104) is created in the conductive layer (103) in the region of at least one through hole, the additional layer (104) comprising nickel. The conductive layer (103) is removed outside the region of at least one through hole (102). The carrier device (121) patterned by this method can be electrically and mechanically coupled to the electronic component. |
| priorityDate |
2009-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |