http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013239567-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0cdb88d7577707b85ff2721c34d1cc83 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 2012-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce432ff7d1e831a4e543d4c5b38d8ddd |
| publicationDate | 2013-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013239567-A |
| titleOfInvention | Semiconductor device and manufacturing method thereof |
| abstract | It is difficult to arbitrarily adjust the warp according to the amount of warp of the wafer, and once the adjustment of the warp is incorporated, it is difficult to eliminate the adjusted warp. A process of attaching a first main surface of a wafer to a support via an adhesive, and a first metal contamination prevention film on a second main surface opposite to the first main surface of the wafer. Forming a second metal contamination prevention film having a stress larger than the stress of the first metal contamination prevention film on the first metal contamination prevention film, and removing the second metal contamination prevention film. And peeling the support and the adhesive from the wafer. [Selection] Figure 12 |
| priorityDate | 2012-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3084099 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419522015 |
Total number of triples: 15.