| abstract |
A resin composition having a long pot life, good fluidity when filling a narrow gap, a low curing temperature, a reduced thermal stress on a semiconductor element after curing, and a high glass transition temperature. Provided are a phenol compound that can be formed, a resin composition containing the phenol compound, and an electronic component device using the same. A phenol compound represented by the following general formula (I): In formula, R < 1 > -R < 8 >, R < 11 > -R < 15 > shows a hydrogen atom or a C1-C18 hydrocarbon group each independently. Two adjacent groups selected from R 1 to R 8 and R 11 to R 15 may be bonded to each other to form a ring. n represents a number of 0 or more. [Selection figure] None |