| abstract |
Disclosed are a metal particle dispersant, a metal particle-dispersed ink having excellent adhesion to a substrate and capable of forming a conductive pattern by a sintering process, and a conductive pattern forming method. A solid polymer comprising a copolymer of a monomer selected from tetrahydrofurfuryl acrylate or tetrahydrofurfuryl methacrylate and a monomer having an adsorptive functional group adsorbed on the metal particles. The molecular compound is a metal particle dispersant that disperses metal particles in a solvent. A metal particle-dispersed ink is prepared using this dispersant, applied onto a substrate, and then sintered to form a conductive pattern. [Selection figure] None |