| abstract |
A circuit connection material having excellent low-temperature curability and a method of manufacturing a mounting body using the circuit connection material are provided. A first adhesive layer containing a polyvinyl acetal resin, a cationic polymerizable resin, a cationic polymerization initiator, and conductive particles, a cationic polymerizable resin, and a cationic polymerization initiator. A circuit connection material that has a two-layer structure in which a second adhesive layer is laminated and that has high capture efficiency of conductive particles even when it is pressure-bonded at a low temperature, and has improved low-temperature curability. [Selection figure] None |