http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013221044-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_063a1b324005ddc15e16e7529c6258c4 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-10 |
| filingDate | 2012-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1528769714e658511c04e32a8a5f505c |
| publicationDate | 2013-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013221044-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract | An epoxy resin composition for semiconductor encapsulation capable of suppressing blocking of a sealing material in powder form or granule form and a semiconductor device using the same. In an epoxy resin composition for semiconductor encapsulation containing an epoxy resin, a curing agent, and an inorganic filler as essential components, the content of the inorganic filler is 1 relative to the total amount of the epoxy resin composition for semiconductor encapsulation. It is in the range of -89% by mass, and the following formula (I): Is contained in a powder or granule form. [Selection figure] None |
| priorityDate | 2012-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 82.