| abstract |
An electronic device capable of suppressing the escape of heat from a metallized layer and reliably bonding a lid portion and a base substrate. An electronic device includes a package and a piezoelectric element housed in a storage space formed inside the package. The package 200 has a base substrate 210 to which the piezoelectric element 300 is fixed, a lid 220 provided so as to cover the piezoelectric element 300, and a frame shape formed on the base substrate 210 to join the base substrate 210 and the lid 220 together. And the electrodes 241, 242, 251 to 254, 261, and 262 that are formed on the base substrate 210 and are electrically connected to the piezoelectric element 300. The metallized layer 230 includes the electrodes 241 and 242. , 251 to 254, 261, and 262 are insulated. [Selection] Figure 5 |