| abstract |
[PROBLEMS] To provide a thermosetting resin composition having excellent low thermal expansibility and heat resistance, particularly exhibiting low thermal expansibility before and after the glass transition temperature (Tg), and a prepreg and a laminate using the same. provide. A siloxane resin having a terminal hydroxyl group (a), a compound (b) having at least two cyanate groups in one molecule, and a compound (c) having at least two epoxy groups in one molecule are identified. Thermosetting resin composition containing compatibilizing resin (A), modified imidazole (B) and compound (C) having phenolic hydroxyl group obtained by reaction in a solvent, and prepreg and laminate using the same It is. [Selection figure] None |