| abstract |
PROBLEM TO BE SOLVED: To form a multilayer resin sheet cured product having high thermal conductivity and excellent in insulation, adhesive strength and thermal shock resistance and excellent in flexibility, and multilayer resin sheet cured product using the same A resin sheet laminate and a semiconductor device are provided. A resin layer containing an epoxy resin, a curing agent and an inorganic filler, and an adhesive layer provided on at least one surface of the resin layer and formed from a resin composition containing an inorganic filler, The multilayer resin sheet whose content rate of the inorganic filler contained in a contact bonding layer is 30-80 mass%, and whose content rate of the inorganic filler contained in the said resin layer is 80-93 mass%. [Selection] Figure 1 |