| abstract |
A wiring board having high reliability and a method for manufacturing the wiring board are provided. A wiring board includes an interlayer insulating layer 26a, a conductor layer 31a formed on the interlayer insulating layer 26a, an interlayer insulating layer 33a provided on the interlayer insulating layer 26a and the conductor layer 31a, and an interlayer The sub-wiring board 10 disposed on the insulating layer 26a and having the insulating layer 110 and the conductor layer 111 on the insulating layer 120, the conductor layer 36a formed on the interlayer insulating layer 33a, and the interior of the interlayer insulating layer 33a And a via conductor 35a connecting the conductor layer 31a and the conductor layer 36a. [Selection] Figure 1B |