| abstract |
The present invention provides a curable epoxy resin composition that has high heat resistance, light resistance, and thermal shock resistance, and can form a cured product that is particularly excellent in moisture absorption reflow resistance. A curing comprising an alicyclic epoxy compound (A), a monoallyl diglycidyl isocyanurate compound (B) represented by the following formula (1), and a polycarbodiimide resin (C). Epoxy resin composition. In the curable epoxy resin composition, the alicyclic epoxy compound (A) is preferably a compound having a cyclohexene oxide group. [Chemical 1] [Wherein R 1 and R 2 represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms] [Selection figure] None |