| abstract |
A semiconductor package that achieves desired electrical characteristics of a semiconductor chip with a simple configuration and a method of manufacturing the same are provided. A semiconductor package includes a semiconductor chip having a front surface electrode on the front surface and a back surface electrode on the back surface and a gap between at least a part of the semiconductor chip, a front surface side through electrode, The semiconductor chip is sealed by being joined to the front-side cap part 26 located on the front side and the first cap part, and there is a gap at least partly between the semiconductor chip, and the back-side through electrode is provided. A back surface side cap portion 36 positioned on the back surface side of the semiconductor chip, a front surface side connection portion that electrically connects the front surface electrode and the front surface side through electrode, and a back surface electrode and the back surface side through electrode. And a back side connection portion to be connected. [Selection] Figure 1 |