http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013203898-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_063a1b324005ddc15e16e7529c6258c4 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2012-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4be18fdad7e347e08411a7a237d914f6 |
| publicationDate | 2013-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013203898-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract | Provided are an epoxy resin composition for semiconductor encapsulation that has excellent filling properties even when highly filled with an inorganic filler, and has excellent reflow crack resistance, and a semiconductor device sealed using the same. . An epoxy resin composition for semiconductor encapsulation containing an epoxy resin, a phenol resin, a curing accelerator, and an inorganic filler as essential components, wherein the epoxy resin is represented by at least the following formula (1). The epoxy resin composition for semiconductor sealing which contains the bisphenol type | mold epoxy resin which has a structure which contains this, and the phenol resin of a specific structure, a hardening accelerator, and an inorganic filler as an essential component. [Selection figure] None |
| priorityDate | 2012-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 37.