http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013193097-A

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classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-42
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363
filingDate 2012-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e27cd28e9000998282e484d22a38d09b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e78075eceb700d631c6d2dc8c0e47b1
publicationDate 2013-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2013193097-A
titleOfInvention Solder composition and method for forming solder bump using the same
abstract The present invention provides a solder composition capable of suppressing the occurrence of a bridge even when the electrode pitch is very narrow, and suppressing a solder amount deficiency and a solder unattached defect. The solder composition of the present invention is a solder composition containing solder powder and a flux, wherein the flux (A) has a softening point of 110 ° C. or lower and an acid value of 140 mgKOH / a rosin-based resin that is not less than g, (B) a rosin ester compound having a softening point of 110 ° C. or less and an acid value of 5 mgKOH / g or less, and (C) a solvent, Is not less than 5 mgKOH / g and not more than 70 mgKOH / g. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3456460-A4
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109420861-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7295157-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7361481-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109641324-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10913132-B2
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priorityDate 2012-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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