abstract |
The present invention provides a solder composition capable of suppressing the occurrence of a bridge even when the electrode pitch is very narrow, and suppressing a solder amount deficiency and a solder unattached defect. The solder composition of the present invention is a solder composition containing solder powder and a flux, wherein the flux (A) has a softening point of 110 ° C. or lower and an acid value of 140 mgKOH / a rosin-based resin that is not less than g, (B) a rosin ester compound having a softening point of 110 ° C. or less and an acid value of 5 mgKOH / g or less, and (C) a solvent, Is not less than 5 mgKOH / g and not more than 70 mgKOH / g. [Selection figure] None |