http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013189667-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4e637de5f54efec56ab27b22cd04f8cb
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16
filingDate 2012-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a507e094439b53c47453e2703d01e55
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ce4146c7e615fdcea9844271b57ca62
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publicationDate 2013-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2013189667-A
titleOfInvention Electroless plating method and metal film forming method
abstract An object of the present invention is to provide an electroless plating method and a metal film forming method capable of forming a metal film with good adhesion on the surface of a resin substrate by a method considering productivity and safety. And In order to achieve this object, in an electroless plating method in which a metal layer is formed on a surface of a resin base material by electroless plating, an average particle size of 0.1 μm to 100 μm is formed on the surface of the resin base material. Electroless plating that forms a metal layer on the surface of the resin base material by electroless plating after contact with ozone water containing fine ozone bubbles and surface modification treatment to modify the surface of the base material Adopt the method. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018080374-A
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priorityDate 2012-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 30.