http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013187491-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2012-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6676acb826e82e48899dd73b5e127908 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_863b40fc4317acfe7035303c8bb5891f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f62a820edc6182247d5a473962bd79a4 |
| publicationDate | 2013-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013187491-A |
| titleOfInvention | Method for manufacturing circuit connection structure |
| abstract | A method of manufacturing a circuit connection structure capable of reducing warpage is provided. A method for manufacturing a circuit connection structure according to an embodiment of the present invention includes a circuit member having a printed circuit board and a wiring, and a circuit member having a semiconductor chip and a wiring. And a laminated body in which the circuit member 10 and the circuit member 20 are pressure-bonded with the adhesive layer 40a interposed between the wiring circuit board 11 and the semiconductor chip 21, and the wiring 13 and the wiring 23 are electrically connected to each other. A connecting step for obtaining 100a, a first heating step for heating the laminated body 100a at the temperature T1 after the connecting step, and a second heating step for heating the laminated body 100a at the temperature T2 after the first heating step. The temperature T1 and the temperature T2 satisfy the condition of the following formula (1). Temperature T1> temperature T2 ≧ glass transition temperature of the adhesive layer 40a (1) [Selection] Figure 7 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11608455-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017045891-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10734350-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017073630-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10669454-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018050031-A |
| priorityDate | 2012-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 99.