| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e1be247490b397cf9460cc670fa33548 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-445 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-0622
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-852
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-4444
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-4494
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-4477 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B8-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R31-00 |
| filingDate |
2013-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30e11519ae14da604858fdba241d6452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22435b32b9eeb3be7bcf16617b7c18b7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_217448763c5e0c8a3f40c2c0aaff58f0 |
| publicationDate |
2013-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2013184064-A |
| titleOfInvention |
Method of manufacturing an ultrasonic transducer used in an ultrasonic imaging device, and an ultrasonic transducer and an ultrasonic probe manufactured by the method |
| abstract |
An improved method of manufacturing an ultrasonic transducer having limited dimensions without reducing imaging resolution. Providing a carrier of semiconductor material comprising a two-dimensional array of conductor pads and an electrical circuit connected to the conductor pads for further processing outside the ultrasonic transducer. Next, a layer comprising piezoelectric material is provided on the carrier, which layer covers a two-dimensional array of conductor pads. Each of the plurality of transducer elements is separated by dicing the two-dimensional array on the carrier. Finally, a ground layer is provided on the plurality of transducer elements to ground each transducer element. Here, a buffer layer is provided between the carrier and the layer comprising the piezoelectric material. The buffer layer has a thickness suitable for dicing each of the plurality of transducer elements on the carrier. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9504444-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019528975-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5841698-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7096237-B2 |
| priorityDate |
2012-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |