| abstract |
Provided are an interlayer prepreg, an alkylsulfonated tetrazole compound that improves the adhesion of a metal to a substrate using a build-up film, a method for producing the compound, an epoxy resin containing the compound, and a substrate produced therefrom. The alkylsulfonated tetrazole compound of the present invention is represented by the following chemical formula 1. (In the formula, R 1 is an aliphatic or alicyclic alkyl group having 1 to 20 carbon atoms, an aryl group or aralkyl group having 1 to 20 carbon atoms, or an alkyl group or aryl substituted with a functional group having 1 to 20 carbon atoms. Selected from groups, alkylene-linked rings with or without heteroatoms, polymeric compound groups, and derivatives thereof, n is an integer from 1-6. [Selection figure] None |