| abstract |
An object of the present invention is to provide excellent moldability, less decrease in mechanical strength and discoloration due to heat and light, high light reflectivity, excellent dimensional stability, and good adhesion of sealing materials for optical semiconductor devices. A curable silicone composition is provided that forms a cured product. (A) An organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having 30 to 60 mol% of all silicon-bonded organic groups having an alkenyl group and having 10 or less silicon atoms; C) an organopolysiloxane, (D) an organopolysiloxane having 2 or more silicon-bonded hydrogen atoms in one molecule, and a phenyl group content of 20 mol% or more based on all silicon-bonded organic groups, E) an organopolysiloxane having a silicon atom-bonded hydrogen atom and a phenyl group content of less than 20 mol% relative to all silicon-bonded organic groups, (F) a catalyst for hydrosilylation reaction, (G) a white pigment, and (H) A curable silicone composition comprising an inorganic filler. [Selection figure] None |