http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013159627-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-458 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31 |
| filingDate | 2012-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20a442f4f735161a071c7a9f7ae0f902 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c394019ec9a3b1af8f2020d27870795f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44366a197abb7fcf9a741017c787c0e3 |
| publicationDate | 2013-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013159627-A |
| titleOfInvention | Metal film deposition re-peeling tape and method for manufacturing semiconductor wafer |
| abstract | A metal film deposition re-peeling tape that imparts high electrostatic chuck adsorption to a support plate for fixing a semiconductor wafer and can be easily replaced, and a semiconductor wafer using the metal film deposition re-peeling tape A manufacturing method is provided. A metal film deposition re-peeling tape for imparting electrostatic chuck adsorption to a support plate for reinforcing a semiconductor wafer in a manufacturing process of a semiconductor chip. The base film comprises a film, a vapor-deposited metal film layer formed on one surface of the base film, and a re-peeling adhesive layer formed on the other surface, and the base film has a thermal shrinkage rate of 10% at 200 ° C. The vapor-deposited metal film layer is made of a metal having a surface resistivity of 10,000 Ω or less when vapor-deposited to a thickness of 1 μm, and the re-peeling pressure-sensitive adhesive layer is 30 ° C. to 200 ° C. under air and normal pressure conditions. A metal film-deposited re-peeling tape comprising a pressure-sensitive adhesive having a weight reduction rate of 10% by weight or less when heated to a thickness of 0.2 to 1.5 N / 25 mm. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6719694-B1 |
| priorityDate | 2012-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.