http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013153088-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b
classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-40
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
filingDate 2012-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3180b6a0c6324ae1b0a02b8e8a740b78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa4074ecf4cec5f240c35b40b55a5a38
publicationDate 2013-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2013153088-A
titleOfInvention Wafer processing tape
abstract An object of the present invention is to provide a wafer processing tape capable of improving the dividing property of an adhesive film and a wafer by expanding and capable of contracting the deflection by the expanding. When an adhesive tape 10 having a base film 11 and an adhesive layer 12 is provided and a wafer W bonded on the adhesive layer 12 is divided by an expand to correspond to individual chips C Or it is used when the adhesive film 13 bonded on the pressure-sensitive adhesive layer 12 and / or the wafer W bonded to the adhesive film 13 is divided corresponding to each chip C and heated after expansion. The tape 1 for wafer processing which shrinks by the above, and the elongation rate of the adhesive tape 10 at 25 ° C. is 200% or more, and after the adhesive tape 10 is extended at 25 ° C. to an elongation rate of 200% or more, it is increased to 100 ° C. By heating, the elongation rate contracts to 120% or less, and the force applied when the contracted adhesive tape 10 is expanded to 120% at 25 ° C. is 2N or more. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107004589-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015185591-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015195264-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015183169-A
priorityDate 2012-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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