http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013151052-A

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filingDate 2012-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2dd0d260d7c9be2636bbe3a0e3a0faa9
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publicationDate 2013-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2013151052-A
titleOfInvention Manufacturing method of polishing pad material
abstract In a manufacturing method of a material for a polishing pad used for forming a flat surface in glass, semiconductor, dielectric / metal composite, integrated circuit, etc., the thickness accuracy of a sliced sheet is improved and a raw material block is improved. A method for improving the number of polishing pad material sheets obtained by slicing is provided. A method of manufacturing a polishing pad material by slicing a raw material block with a slicer, wherein the slicing step has a Shore D hardness of 40 to 70 and a thickness of 15 mm to 30 mm. Are first sliced into two in the thickness direction, and then sliced into a sheet having a thickness of 1 mm to 3 mm. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015051489-A
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