http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013147624-A

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filingDate 2012-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_afe4a1c5889ceabd8430556d63b26c6c
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publicationDate 2013-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2013147624-A
titleOfInvention Treatment and treatment method for improving adhesion between copper and copper alloy and organic coating
abstract The present invention provides a treatment solution that enables strong adhesion without roughening the metal surface by polishing or the like for adhesion between the metal surface and the organic coating. An acidic treatment solution for improving adhesion to an organic film by adsorbing a compound having one or more of sulfur, nitrogen and oxygen having unshared electrons on a metal surface. [Selection figure] None
priorityDate 2012-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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