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filingDate 2012-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2013-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2013143528-A
titleOfInvention Manufacturing method of semiconductor device
abstract An electrode of a metal material that is difficult to process can be stably formed. According to this embodiment, a method for manufacturing a semiconductor device is provided. In the method for manufacturing a semiconductor device, a first layer 15 containing Si is formed on a semiconductor substrate 10. Impurity regions 21 and non-impurity regions 22 are formed in the first layer by selectively diffusing impurities in the first layer. A second layer 23 containing a metal material is formed on the first layer. By annealing the second layer, the metal material is diffused into the non-impurity region. [Selection] Figure 5
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