| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_06b5ba9f1c3377eb8b1e9eafec79b7e5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0554
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0338
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05573
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0113
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-742
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K3-0623
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-488
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3478 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2013-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d6db79f7f2147470c5cc3bc6df2da6e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d3ba63c333c53237fd7e2dc7a034ce7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c9c88c0fdc0975eacc10e0dee8032774
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7b116e75cb0ded59f80f4bb19b26093 |
| publicationDate |
2013-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2013138243-A |
| titleOfInvention |
Apparatus and method for forming bumps on a semiconductor wafer by injection molded solder |
| abstract |
An improved apparatus and method for forming bumps on a semiconductor wafer using an injection molded solder process. An apparatus is designed for mass production and includes an apparatus for filling a patterned mold cavity formed on a first surface of a mold structure with solder, and a patterned first surface of a semiconductor structure. For positioning and aligning the mold structure solder directly opposite the patterned mold cavity filled with, and for holding and transferring the aligned mold and semiconductor structure together A fixture and a device 301 for receiving the fixture and transferring the solder from the aligned patterned mold cavity to the aligned patterned first surface of the semiconductor. [Selection] Figure 10 |
| priorityDate |
2007-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |