http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013138124-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2011-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4810bc1805bfc4517d3db9fc876d259a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f08a2578338858c1998ecbbe560e678 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57003384f6b234c192e0cc572ca914ab http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9b22aad765242296c9ce1362e78aeb8 |
| publicationDate | 2013-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013138124-A |
| titleOfInvention | Multilayer printed wiring board manufacturing method, multilayer printed wiring board manufactured by the manufacturing method, and curable resin composition used in the manufacturing method |
| abstract | An object of the present invention is to reduce the polishing cost by omitting the polishing process of the hole filling surface, shorten the manufacturing process, avoid the deformation (dimension change) of the substrate due to polishing and the situation of scraping to the copper foil, and heating and heating. Provided is a method for manufacturing a multilayer printed wiring board, which can simplify the process by forming the outer layer all together in the pressing process. A method of manufacturing a multilayer printed wiring board includes filling a curable resin composition into a double-sided board of a printed wiring board or a through-hole of a multilayer board, and curing the curable resin composition before curing the curable resin composition. A step of planarizing the surface of the resin composition by a method other than polishing. In a more specific preferred embodiment, after the filling step and the flattening step, a step of curing the curable resin composition filled in the hole, and a prepreg or dry film type insulating material and / or metal with resin The steps of laminating the foil and forming it by heating and pressing are performed in the above order. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105101681-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7282595-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104320929-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104320929-A |
| priorityDate | 2011-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 188.