| abstract |
An electronic device including a circuit board on which electronic components are mounted by soldering, which is less likely to cause a short circuit between terminal electrodes during flip chip mounting. An electronic device includes an electronic component having a plurality of terminal electrodes, a circuit board on which wirings are formed, a solder that joins the wirings, and the terminal electrodes. A resin filling layer 40 filled between the electronic component 10 and the circuit board 20 is provided so as to surround the solder 30. On the surface of the electronic component 10 on the side where the terminal electrodes 12 are formed, at least one of a concave portion and a convex portion 14 is formed between the adjacent terminal electrodes 12. [Selection] Figure 1 |