http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013128080-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-42 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C12-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate | 2011-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ce6f29ec0c3fb3ec9f7769a4e103fa7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_58f4c23ee96b8025b0309bcc9331859e |
| publicationDate | 2013-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013128080-A |
| titleOfInvention | Electronic device and manufacturing method thereof |
| abstract | In solder bonding using Sn-Bi solder, the diffusion of Sn or other metal elements from an Sn-based electrode is prevented, and deviation from the optimal composition of the solder alloy is suppressed. A method of manufacturing an electronic device includes a complex or salt of a third metal element different from Sn and Bi on a first electrode of a first electronic element having at least a surface comprising a metal layer containing Sn. A step of forming a layer containing Sn, a step of applying a solder alloy paste containing Sn and Bi on the second electrode of the second electronic element, and a step of applying the layer and the paste on the first electrode. A step of contacting the second electrode of the second electronic element, reflowing the solder alloy in the paste, and electrically connecting the first electrode and the second electrode by a solder joint. In the reflow step, an alloy layer of a third metal element other than Sn and Bi and Sn is formed at the first interface between the first electrode and the solder joint. It is formed. [Selection] Figure 3 |
| priorityDate | 2011-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.