http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013125787-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06562 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate | 2011-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0fe833ffda8089577b42b1ae771e27a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c70f600eaa44081fb57c77d7840d9d7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_098fade92ab809179dc4e98a74550d3b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_046d9297b6ff6ac0a54e343c13a9a482 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07c99123818ffc3164a400e7c947a163 |
| publicationDate | 2013-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013125787-A |
| titleOfInvention | Semiconductor device and manufacturing method thereof |
| abstract | A semiconductor device capable of suppressing the formation of voids between adherends and obtaining sufficient reflow resistance even in a moisture-absorbing state and a method for manufacturing the same are provided. A manufacturing method of a semiconductor device 1 includes a bonding step of thermocompression bonding a support member 2 having one surface 2a on which irregularities are formed and a semiconductor chip 3 having the other surface 3b through a die bonding film 8. Is provided. In the bonding step, a die bonding film 8 having a thickness that is at least twice as large as the step between the convex portion P1 and the concave portion S1 on the one surface 2a is interposed between the one surface 2a and the other surface 3b, and the die bonding film 8 is melted. One surface 2a and the other surface 3b are thermocompression-bonded while heating so that the viscosity becomes 1000 Pa · s or more and 20000 Pa · s or less. [Selection] Figure 1 |
| priorityDate | 2011-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.